Safeguard your critical high-performance electronics and eliminate localized heat micro-pockets with the premium Cooler Master Thermal Pad 3.0mm (Model: TPY-NOPP-9030-R1). Specifically engineered for repair technicians, hardcore overclockers, crypto-mining operators, and custom system builders across Myanmar, this enthusiast-grade thermal interface material sets a new benchmark in solid-state cooling. Boasting a massive **13.3 W/mK high thermal conductivity rating**, it safely bridges large structural gaps between hot components and heatsinks. Whether you are replacing thick, degraded memory VRM padding on an oversized graphics card in Yangon or servicing a hot laptop motherboard workstation in Mandalay, this 3.0mm thermal pad ensures uniform, rapid heat displacement.
Key Features & Next-Gen Thermal Dynamics
Extreme 13.3 W/mK Thermal Performance Conductivity
Don't let low-tier interface materials limit your hardware lifespans. Formulated with highly advanced nano-zinc and silicon chemical compounds, this pad delivers a phenomenal **13.3 W/mK structural conductivity rating**. It outpaces generic silicone pads by over 300%, instantly transferring intense thermal spikes away from processors and memory modules out to your copper heatsink cooling paths.
Complete Non-Electrical Conductivity & Short-Circuit Protection
Work on expensive electronic circuitry with absolute peace of mind. This Cooler Master Thermal Pad is carefully formulated to be **100% non-electrical conductive and non-capacitive**. It contains completely metal-free chemical structures, meaning there is zero risk of sudden electrical bridging, hardware short-circuits, or permanent discharge damage to exposed motherboard tracing lines or micro-capacitors.
Thick 3.0mm Profile with Malleable Design
Achieve flawless mechanical contact across varied, large-gap surfaces. This 3.0mm variant possesses an optimal structural flexibility matrix that compresses smoothly under heatsink clamping pressure. Coupled with pre-applied **dual-sided mild stick adhesive properties**, it securely grips surface faces without tearing, making mounting fast, tidy, and perfectly level.
Universal Cut-to-Size Application Grid
Ultimate versatility comes standard. Shipped in a clean **95 x 45 mm dimension sheet**, the pad features a clear spatial blueprint layout that can be sliced effortlessly with standard scissors or precise hobby knives. Easily shape custom-fit thermal strips for graphics card VRAM chips, high-speed M.2 NVMe solid-state drives, regulatory VRMs, power stages, and single-board electronics modules.
Resilient Anti-Cracking, Non-Toxic Long Life Matrix
Engineered to handle extreme operational environments throughout Myanmar's changing seasonal temperatures. The specialized compound resists chemical breakdown, fluid bleeding, and thermal drying out. Operating perfectly across intense thermal ranges, it remains fully pliable over years of continuous structural heat exposure.
Technical Specifications
| Hardware Parameter | Official Specifications |
|---|---|
| Product Name | Cooler Master Thermal Pad 3.0mm |
| Model Number | TPY-NOPP-9030-R1 |
| Thermal Conductivity Rating | 13.3 W/mK (Enthusiast Overclocking Grade) |
| Pad Thickness Dimension | 3.0 mm ± 0.1mm Large-Gap Clearance Profile |
| Total Sheet Scale (L x W) | 95 x 45 mm (3.74 x 1.77 inches) Sheet Footprint |
| Electrical Conductivity | Non-Conductive / 100% Dielectric Insulation Safeguard |
| Specific Gravity Compound Density | 3.4 ± 0.2 g/cm³ |
| Hardness Structural Value | 30 - 60 Sc (Sc-Scale Compression Index) |
| Safe Operational Temperature Limit | -40°C up to 200°C Structural Safety Bound |
| Primary Component Base | Advanced Silicone Compound Infused with Nano-Thermal Zinc Oxides |
FORMULATED WITH NANO ELEMENTS
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
NON-TOXIC AND NON-CORROSIVE
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
DOUBLE-SIDED ADHESIVE
Provides seamless and secure contact between surfaces.
WIDE RANGE OF APPLICATION
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
