Safeguard your high-performance computing hardware and prevent thermal throttling with the premium Cooler Master Thermal Pad 1.5mm (Model: TPY-NOPP-9015-R1). Specifically engineered for hardware repair technicians, extreme overclockers, crypto-mining operators, and custom system builders across Myanmar, this enthusiast-grade thermal interface material bridges vital physical gaps between hot components and heatsinks. Boasting a massive **13.3 W/mK high thermal conductivity rating**, it delivers rapid, uniform heat displacement. Whether you are replacing dried-out factory memory VRAM padding on an oversized graphics card in Yangon or servicing regulatory VRM circuits on a high-end desktop motherboard in Mandalay, this 1.5mm thermal pad ensures reliable solid-state cooling paths.
Key Features & Next-Gen Thermal Dynamics
High-Performance 13.3 W/mK Thermal Conductivity
Don't let inadequate interface components limit your hardware's operational lifespan. Formulated with advanced nano-zinc and silicon chemical compounds, this pad delivers an impressive **13.3 W/mK structural conductivity rating**. It outpaces standard generic silicone padding by leaps and bounds, pulling intense heat spikes away from high-temperature microchips out to your cooling fins instantly.
Complete Non-Electrical Conductivity & Circuit Protection
Work on expensive electronic circuitry with absolute peace of mind. This Cooler Master Thermal Pad is carefully formulated to be **100% non-electrical conductive and non-capacitive**. It contains completely metal-free chemical structures, meaning there is zero risk of accidental electrical bridging, hardware short-circuits, or permanent static discharge damage to exposed motherboard tracing lines or micro-capacitors.
Versatile 1.5mm Profile with Malleable Compressibility
Achieve flawless mechanical contact across varied, medium-gap surfaces. This 1.5mm variant possesses an optimal structural flexibility matrix that compresses smoothly under heatsink clamping pressure. Coupled with pre-applied **dual-sided mild stick adhesive properties**, it securely grips surface faces without tearing, making mounting fast, tidy, and perfectly level.
Universal Cut-to-Size Application Grid
Ultimate versatility comes standard. Shipped in a clean **95 x 45 mm dimension sheet**, the pad features a clear spatial blueprint layout that can be sliced effortlessly with standard scissors or precise hobby knives. Easily shape custom-fit thermal strips for graphics card VRAM chips, high-speed M.2 NVMe solid-state drives, regulatory VRMs, power stages, and single-board electronics modules.
Resilient Anti-Cracking, Non-Toxic Long Life Matrix
Engineered to handle extreme operational environments throughout Myanmar's changing seasonal temperatures. The specialized compound resists chemical breakdown, fluid bleeding, and thermal drying out. Operating perfectly across intense thermal ranges, it remains fully pliable over years of continuous structural heat exposure.
Technical Specifications
| Hardware Parameter | Official Specifications |
|---|---|
| Product Name | Cooler Master Thermal Pad 1.5mm |
| Model Number | TPY-NOPP-9015-R1 |
| Thermal Conductivity Rating | 13.3 W/mK (Enthusiast Overclocking Grade) |
| Pad Thickness Dimension | 1.5 mm ± 0.1mm Precision Tolerance Limit |
| Total Sheet Scale (L x W) | 95 x 45 mm (3.74 x 1.77 inches) Sheet Footprint |
| Electrical Conductivity | Non-Conductive / 100% Dielectric Insulation Safeguard |
| Specific Gravity Compound Density | 3.4 ± 0.2 g/cm³ |
| Hardness Structural Value | 30 - 60 Sc (Sc-Scale Compression Index) |
| Safe Operational Temperature Limit | -40°C up to 200°C Structural Safety Bound |
| Primary Component Base | Advanced Silicone Compound Infused with Nano-Thermal Zinc Oxides |
THERMAL PAD
Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components
FORMULATED WITH NANO ELEMENTS
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
NON-TOXIC AND NON-CORROSIVE
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
DOUBLE-SIDED ADHESIVE
Provides seamless and secure contact between surfaces.
WIDE RANGE OF APPLICATION
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
